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 (R)
USB6Bx
DATA LINES PROTECTION
Application Specific Discretes A.S.D.
APPLICATIONS Where transient overvoltage protection in sensitive equipment is required, such as: - Universal Serial Bus ports - RS-423 interfaces - RS-485 interfaces - ISDN equipment - T1/E1 line cards - HDSL / ASDL interfaces FEATURES n Full diode bridge with integrated clamping protection n Breakdown voltage : VBR = 6V min. n Peak pulse power dissipation : PPP = 500W (8/20s) n Very low capacitance, compatible with high debit data or signal rates. DESCRIPTION In order to prevent fast transients from leading to severe damages in a high speed data system, a specific protection has been developed by STMicroelectronics. The USB6Bx protects the two input lines against overvoltage. Besides, this device also keeps the power rails in a safe limit thanks to the integrated Transil diode. BENEFITS
n
SO8
DIL8
n
n
n
Provides protection for each line and between the supply voltage and GND : 25A , 8/20s. High ESD protection level : up to level 3 per MIL STD 883C-Method 3015-6 Separated inputs and outputs (so-called 4-point structure) to improve ESD susceptibility. Comprehensive package pin-out for immediate implementation.
FUNCTIONAL DIAGRAM
COMPLIES WITH THE FOLLOWING STANDARDS: MIL STD 883C - Method 3015-6 class 3 C = 100 pF R = 1500 3 positive strikes and 3 negative strikes (F = 1 Hz) IEC-1000-4-2 level 4 15 kV (air discharge) 8 kV (contact discharge)
TM: ASD and TRANSIL are trademarks of ST Microelectronics.
Vcc I/01 I/02 GND
Vcc I/01 I/02 GND
August 1999 Ed : 5A
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USB6Bx
TECHNICAL INFORMATION SURGE PROTECTION The USB6Bx is particularly optimized to perform surge protection based on the rail to rail topology. The clamping voltage VCL can be estimated as follow: VCL+ =Vcc + VF for positive surges for negative surges VCL - = - VF with: VF = Vt + rd.Ip (VF forward drop voltage) / (Vt forward drop threshold voltage) Note: the estimations do not take into account phenomena due to parasitic inductances.
Fig. A1 :
ESD SURGE Vf I/O Lw +Vcc Lw di dt
di Vcl+ = Vcc+Vf+ Lw dt surge >0 VI/O Lw di dt Vcl- = -Vf- Lw di dt surge <0
GND
tr=1ns
Vcl+
t
-Vf Lw di dt Vcc+Vf
t
POSITIVE SURGE
-Lw
di dt
NEGATIVE SURGE
Vcltr=1ns
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USB6Bx
HOW TO ENSURE A GOOD ESD PROTECTION While the USB6Bx provides a high immunity to ESD surge, an efficient protection depends on the layout of the board. In the same way, with the rail to rail topology, the track from the VCC pin to the power supply and from the GND pin to GND voltage must be as short as possible to avoid overvoltages due to parasitic phenomena (see Fig A1). It's often harder to connect the power supply near to the USB6Bx unlike the ground thanks to the ground plane that allows a short connection. To ensure the same efficiency for positive surges when the connections can't be short enough, we recommend to put close to the USB6Bx between VCC and ground, a capacitance of 100nF to prevent from these kinds of overvoltage disturbances (see Fig. A2 ). The add of this capacitance will allow a better protection by providing during surge a constant voltage. Fig. A3 shows the improvement of the ESD protection according to the recommendations described above. Fig. A2: ESD behavior: optimized layout and add of a capacitance of 100nF.
Lw
REF2=+Vcc
C=100nF
ESD SURGE
I/O Vcl+ = Vcc+Vf VI/O Vcl- = -Vf surge >0 surge <0
REF1=GND
Vcl+
t
POSITIVE SURGE
NEGATIVE SURGE
t
Vcl-
IMPORTANT: A main precaution to take is to put the protection device closer to the disturbance source (generally the connection).
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USB6Bx
TECHNICAL INFORMATION Universal Serial Bus. The new data transmission standard, Universal Serial Bus (USB) is being driven by market leaders in the world of Computer and Telecommunications, including Compaq, DEC, IBM, Intel, Microsoft, NEC and Nortel, and will become the leading transmission protocol within the next few years. This standard mainly provides simplified interconnectivity. Specialized ports on the back of the present PC will largely be replaced by USB ports. Many peripherals such as printers, keyboards, monitors and joysticks will also host USB ports. The USB offers high speed communication rates up to 12 Mbit/s. Only two wires (D+, D-) are required for data transfer. Additionally, limited amount of power for USB devices located on the downstream can also be transmitted on two separate conductors within the same cable. Protection to support USB. Designers dealing with the USB chips are concerned about electrostatic discharge sensitivity (ESD) of their USB controller ICs. The USB controller is more than just a driver / receiver; it acts as a microcontroller which manages power and direct signal traffic. This complexity increases its cost over conventional devices. Therefore, a failure of a USB port could result in costly computer failure. In order to prevent these fast transients from leading to severe damages in a system, a specific protection has been developed by STMicroelectronics. The USB6Bx protects not only the two wires of data transmission, but also keep the power rails in a safe limit.
Fig. A3: recommended configuration for USB port protection.
Vbus D+ DGND
USB output connector
1
USB IC
The capacitance between the I/O transmission wires provides no significant signal distortion at the 12 Mbit/s data rate, thus allowing full compatibility with USB standard.
Available either in a compact SO8 or in a through-hole DIL8 package, this protective element requires minimal board space and eases the PCB layout thanks to its direct compatibility with the USB connector pin-out.
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USB6Bx
TELECOM AND DATACOM APPLICATIONS
ISDN U interface protection.
USB6Bx
3* SMP100
+Vcc
LT
DC Power Source
T1 / E1 Line Card Protection.
USB6B1 SMP75-8 or SMP100-8
RTIP
+Vcc
RRING
TTIP
+Vcc
TRING USB6B1 SMP75-8 or SMP100-8
High Speed Line Driver / Receiver Protection.
+5V SM6T6V8A +5V SM6T6V8A
+Vcc
+Vcc
INPUT
DRIVER
RECEIVER
OUTPUT
USB6B1
USB6B1
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USB6Bx
ABSOLUTE MAXIMUM RATINGS (Tamb = 25C) Symbol VPP Peak pulse voltage Parameter IEC1000-4-2 contact discharge IEC1000-4-2 air discharge MIL STD883C-Method 3015-6 8/20 s 8/20 s Value 8 15 4 500 25 - 55 to + 150 + 150 260 Unit kV
PPP IPP Tstg Tj TL
Peak pulse power Peak pulse current Storage temperature range Maximum junction temperature Lead solder temperature (10s duration)
W A C C C
ELECTRICAL CHARACTERISTICS (Tamb = 25C) Value Symbol VBR IRM C Parameter min. Breakdown voltage between Vbus and GND Leakage current Capacitance between pins D+ and DVOSC =30mV, F=1MHz, VR=0V Capacitance between pins D+ (or D-) and GND VOSC =30mV, F=1MHz, VR=5V IR=1mA VRM=5.25V VCC not connected VCC=5V 15 25 6 10 typ. max. V A pF pF Unit
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USB6Bx
Fig 1: Peak power dissipation versus initial junction temperature.
Ppp[Tj initial]/Ppp[Tj initial=25C] 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 Tj initial(C) 0.0 -40 -20 0 20 40 60 80 100 120 140 160
Fig 2: Relative variation of leakage current versus junction temperature (typical values).
IR[Tj] / IR[Tj=25C]
10.0
1.0
Tj(C) 0.1 -40 -20 0 20 40 60 80 100 120 140
Fig 3: Relative variation of breakdown voltage versus junction temperature (typical values).
VBR[Tj] / VBR[Tj=25C]
1.10
1.05
1.00
0.95 Tj(C) 0 20 40 60 80 100 120 140
0.90 -40 -20
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USB6Bx
ORDER CODE
USB
6
B1
RL
PACKAGING: RL = tape and reel.(SO8 only) = tube
VBR min
PACKAGE: 1 = SO8 2 = DIL8
PACKAGE MECHANICAL DATA. SO8 Plastic DIMENSIONS REF. A
c1 C a3 a2 A
Millimetres Min. Typ. Max. 1.75 0.1 0.65 0.35 0.19 0.25 4.8 5.8 1.27 3.81 3.8 0.4 4.0 0.6 8 (max) 0.15 1.27 0.016 0.50 0.25 0.004 1.65 0.85 0.025 0.48 0.014 0.25 0.007 0.50 0.010 45 (typ) 5.0 6.2 0.189 0.228 Min.
Inches Typ. Max. 0.069 0.010 0.065 0.033 0.019 0.010 0.020 0.197 0.244 0.050 0.150 0.157 0.050 0.024
L
a1 a2 a3 b b1 C c1 D
b e3
e
S
E
a1
b1
D M
8
5 F
E e e3 F L M S
1
4
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USB6Bx
PACKAGE MECHANICAL DATA. DIL8 Plastic DIMENSIONS REF.
I
Millimetres 0.51 0.85 0.5 0.38 8.10 8.80 2.54 7.62 7.1 5.1 3.3 1.50 0.50 0.015 10.15 1.40 0.033
Inches 0.020 0.055 0.020 0.020 0.399 0.100 0.300 0.280 0.200 0.130 0.063
Min. Typ. Max. Min. Typ. Max. a1
b1
a1
L
B b b1 D
F
B
e
b
Z
e3 D
Z
E
E e e3 F I L Z
9.40 0.319 0.346 0.370
8
5
1
4
MARKING Types USB6B1 USB6B2 Package SO8 DIL8 Weight 0.077g 0.59g Marking USB62 USB62 ORDER CODE USB6B1 USB6B1RL USB6B2 - Epoxy meets UL94, V0 Base Qty 100 pcs (tube) 2500 pcs (tape and reel) 50 pcs (tube)
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics (c) 1999 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com
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